ServiceITV-SMT implements the following basic types of assembly:
- one-sided and double-sided automatized mounting of SMD components.
To this group belong
passive chip-components in cases of 0201, 0402, 0603, 0805, 1206 size and
higher, microcircuits in SO, PLCC, TQFP, BGA cases
with fine pitch, and other components not listed above but
assembled on PCB surface.
Assembling is realized using:
SMD components are mounted on soldering paste or clue, applied on PCB
In case of double-sided mounted SMD components are first mounted on
upper side of PCB by means of soldering paste. The paste is fused
in convectional oven. Then, SMD components are mounted on PCB
underside using SMD glue. The glue is polymerized in convectional oven.
Soldering of SMD components on underside is realized by soldering wave.
Double-sided assembly of SMD components may be also realized
by means of two soldering pastes with different fusion temperature.
For the purpose of reduction of assembly labouriousness PCBs of small
dimensions are combined into multiplicate. After SMD components assembly multiplicate
is divided into constituents. TV-SMT engineers may advise
customer on PCB design, so that not labouriousness
and cost of PCB assembling proved to be minimal.
recommendations on PCB design are available for customers as separate document.
- one-sided or double-sided compound mounting and assembling of
Here belong various fasteners, splits,
transformers, brackets, jigs, liquid-crystal displays and so on.
During compound mounting firstly automatized mounting of
SMD components is realized using soldering paste or SMD glue (depending on
what PCB side are SMD components mounted). Then terminal components
are placed in plated holes on hand conveyer.
The conveyer has five working places. Conveyer width may be
changed. Soldering of terminal components is realized by soldering wave.
In separate cases soldering of terminal components may be implemented
by soldering tool.
- one-sided and double-sided mounting of terminal components into
This group of components includes
conventional passive components with axled roll-outs, passive and active
components with radial roll-outs and DIP microcircuits. One-sided
mounting of terminal components into plated holes is realized by means of
wave soldering machine. Double-sided mounting of terminal components into
plated holes may be implemented by combined use of wave soldering machine
and soldering tool.
All assembled PCBs go through visual inspection as to accuracy of electronic
components mounting: presence, offset, polarity, microcircuit orientation,
soldering quality. Besides, by customer request we implement assembling of
construction units into cases and assembling of finished products with further
follow-up function inspection on test equipment
We implement selection and purchase of radio-electronic components according to
technical requirements of customers. We maintain friendly relations with
leading manufacturers of PCBs and suppliers of radio-electronic components
in Ukraine as well as abroad.
When using our service your receive:
- Fixed and predictable costs.
Now you now exactly how much assets and time requires performing the order.
We aim at achieving the lowest prices in Ukraine.
- Minimum term of product manufacture. All launching processes of new products are perfected.
- Admission to high level technologies and decisions as well as to know-how.
Specialists of our company have 7-years experience in automatic assembling of printed circuit boards and cooperation with the most demanding customers.
- Reduced risk. We guarantee high quality of work.
Our enterprise is passing through certification process on ISO9001:2000 quality standard.